Handlevagon 0
Dette er et testområde: Du er nå på våre testsider. Gå til standard.no for våre ordinære nettsider. standard.no
Standard

IEC 60191-6:2009 ED3

Publisert
Forhåndsvisning

Rettelser og tillegg kjøpes separat.

Språk
Tjenester

Omfang

IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition: a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8; b) editorial modifications on several pages; and c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.

Dokumentinformasjon

  • Standard fra IEC
  • Publisert:
  • Utgave: 3
  • Versjon: 1
  • Varetype: IS
  • Products.Specs.pages
  • ICS 31.080.01
  • ISO TC TC 47/SC 47D

Produktrelasjon

Produkt livssyklus